[ Application & Application form ]
(pic : Free-Photos / 9129, pixabay.com)
○ Initial Team Build-up : No more than 4 people
max 4 persons comprise of 1 H/W developer or more, 1 S/W developer or more
※ Please note that 3D modeling, 3D printing, laser cutting, CNC engraving, PCB, SMT will be serviceable at Makerspace G·Camp
○ Development. Condition
- one of the below conditions
① TIZEN (www.tizen.org) Only
② TIZEN (www.tizen.org) + (Service Cloud) SmartThings, AWS, Nubison Cloud, ThingsPark Cloud
One development board will be is issued to a team. but if you want other board, this wouldn't matter.
○ Application Form [Download application form below]
application_form_seoul_Hardware_hackathon_Top_Maker_English.docx0.03MB
○ Submission and its Deadline
- Please fill it out the application and send it to us at Mr. Kitae Park, at Makerspace G·Camp, gitaepak@sba.kr / 02-2135-5280, 010-6785-3678
- Deadline: 14 Aug. 2019
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